BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11
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Product details
Description
The BaKu 3D BGA CPU Tin Planting Mesh is a repair platform designed for BGA tin planting on motherboards. It provides precise positioning for professionals working on iPhone A11 repairs.
- Product Type: Repair Platform
- Compatibility: iPhone A11
- Material: High temperature resistant
- Key Feature: Precise positioning
- Dimensions: 85 x 85 x 15 mm
- Weight: 376 grams
- Intended Use: BGA tin planting
- Durability: High strength, resistant to deformation
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