EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair

EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket is a test block designed for integrated circuit (IC) testing. It is used in mobile phone repair to facilitate data recovery by connecting ICs to a computer via an SD interface.

• Type: Test block
• Interface type: SD
• Application: Integrated circuit (IC)
• Test method:
  • Select the limit frame that matches the IC and place the IC flat in the socket according to the direction.
  • Insert the SD interface into the card reader and connect to the computer, selecting the corresponding test program.
• Compatibility:
  • Compatible with 169-FBGA and 153-FBGA ICs
• Materials:
  • Shrapnel made of imported beryllium copper with high-precision die stamping
  • Gold plating on hardened and thickened head shape for stability and durability
• Features:
  • Compatible with ball and no ball test; IC limit frame can be replaced
  • Overall structure of contact module reduces repeated positioning issues
  • High pass rate in one test due to accurate alignment with IC PAD
  • Welding structure ensures good contact and stable testing
  • Flip cover structure for convenient manual testing
  • Mold integral molding and spring self-adaptive structure for ICs of varying thickness (0.6-2.0MM)
  • Injection molding for precise positioning and higher work efficiency
• Repair and maintenance:
  • Use an air gun or anti-static brush to remove impurities from the socket seat
  • Clean the socket with absolute alcohol to remove impurities from the shrapnel
  • Replace shrapnel if burned or broken
  • Ensure USB interface is not plugged in during detection
  • Avoid cleaning with organic solvents to prevent damage
  • Seal with an anti-static bag when not in use for extended periods