Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
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Product details
Description
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform is a repair platform designed for soldering. It provides strong magnetic adsorption for accurate positioning and efficient soldering of components on iPhone 11 and 11 Pro motherboards.
- Product Type: Repair Platform
- Compatibility: iPhone 11 / 11 Pro
- Material: Pewter
- Key Feature: Strong magnetic adsorption
- Intended Use: Soldering
- Temperature Resistance: High temperature resistance
- Heat Dissipation: Easy heat dissipation
- Operation: Simple operation
- Positioning: Accurate positioning without damage to the motherboard
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