Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max
Spread the cost
Mobicred is a third-party credit option. Approval and terms are determined by Mobicred.
- Approval by Mobicred
- Rate & fees in your pre-agreement
- Repayments confirmed before acceptance
- Your interest rate, fees and repayment schedule are shown in Mobicred's pre-agreement.
- Approval and your credit limit are determined by Mobicred.
- Review the credit terms before accepting the agreement.
Available payment options are confirmed at checkout.
Continue to checkoutDon't have Mobicred yet? Visit Mobicred →
Credit is subject to Mobicred approval and terms. Your limit, interest rate, fees and repayment schedule are disclosed by Mobicred before acceptance. Mobicred terms and conditions
Duties & Import Tax Information
In Stock
Processing: 1–3 days
Couldn't load pickup availability
Product details
Description
Kaisi Mainboard Middle Layer Board is a repair platform designed for soldering. It provides strong magnetic adsorption for accurate positioning during BGA reballing.
- Product Type: Repair Platform
- Compatibility: iPhone X / XS / XS Max
- Material: Metal
- Key Feature: Strong magnetic adsorption
- Intended Use: Soldering
- High temperature resistance
- Easy heat dissipation
- Accurate mesh position planting for pewter
- No damage to the motherboard
- Fast and convenient soldering
Questions about features, compatibility, or warranty? Chat with our local support team!
