Mr.Yang Adjustable IC Chip Degumming Station
Mr.Yang Adjustable IC Chip Degumming Station
Spread the cost
Mobicred is a third-party credit option. Approval and terms are determined by Mobicred.
- Approval by Mobicred
- Rate & fees in your pre-agreement
- Repayments confirmed before acceptance
- Your interest rate, fees and repayment schedule are shown in Mobicred's pre-agreement.
- Approval and your credit limit are determined by Mobicred.
- Review the credit terms before accepting the agreement.
Available payment options are confirmed at checkout.
Continue to checkoutDon't have Mobicred yet? Visit Mobicred →
Credit is subject to Mobicred approval and terms. Your limit, interest rate, fees and repayment schedule are disclosed by Mobicred before acceptance. Mobicred terms and conditions
Duties & Import Tax Information
In Stock
Processing: 1–3 days
Free shipping from R250 Orders under R250 ship for R49.
Couldn't load pickup availability
Product details
Description
2. Tempered glass, high temperature resistant and easy to clean
3. Precisely adjustable clamping width, compatible with chips of various sizes
4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components
5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins
6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.
Questions about features, compatibility, or warranty? Chat with our local support team!
