Qianli QS04 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone X/8/8 Plus
Qianli QS04 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone X/8/8 Plus
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Product details
Description
BGA stencils are used for reballing and rework of integrated circuits. They provide precise positioning for effective replacement of IC or BGA components.
- Product Type: BGA Stencils
- Brand: QIANLI
- Compatibility: iPhone X, iPhone 8, iPhone 8 Plus
- Material: High-quality steel
- Key Feature: High temperature resistance
- Design: Square hole design for precise positioning
- Durability: Strong and durable construction for long service life
- Intended Use: Reballing and rework of IC or BGA components
- Size: Small and compact
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